The use of indium foil in microchips is primarily due to several key properties of indium:
- Low Melting Point: Indium has a relatively low melting point of around 156.61°C. This allows indium foil to be melted and used for connections or soldering without damaging other microchip components.
- Excellent Ductility and Malleability: Indium has superb ductility and malleability, allowing it to be easily processed into thin sheets or foils, which are suitable for fine connections in microchips.
- Electrical Conductivity: Indium is a good conductor, which is crucial for electronic connections within microchips.
- Thermal Conductivity: Indium possesses good thermal conductivity, aiding in heat management within microchips.
- Compatibility: Indium is compatible with silicon and other semiconductor materials, which is essential for microchip production.
In the manufacturing process of microchips, indium foil can be used to create connections between wafers, which are part of the internal electronic circuits of the microchip. Additionally, indium can be used in the chip packaging process and as part of certain types of sensors and optoelectronic devices.