Indium tin foil is a type of alloy made from a combination of indium and tin. It can be produced with different ratios of indium and tin, such as In50Sn50 or In48Sn52 by weight, it also can custom the ratio based on clients, so the melting point is different accordingly. Indium tin alloy can process into foil, sheet, string, pad and wire or even bar. The smallest thickness of foil is 0.05mm with maximum length of 1000mm and maximum wideth of 400mm.
Indium can alloy with different metals like gallium, tin, copper, zinc, aluminum, bismuth, silver, antimony and so on. Galinstan is customizable too, which is gallium-indium-tin alloy and available in liquid, ingot and pad form. GaInSn gets different ratio as Ga68%In22%Sn10%, Ga62%In22%In16%, Ga66%In20.5%In13.5%, 68.5%21.5%10%, they are eutectic alloys with low melting point. Those low melting point alloy can be used as a thermal interface materials for computer CPU, GPU cooling, the highest thermal conductivity compared to thermal pastes and thermal epoxies.
One significant application of indium tin foil is in the field of electronics, where it is utilized as a bonding material, particularly in semiconductor packaging and assembly processes. Its low melting point and excellent thermal and electrical conductivity make it ideal for these applications.
Additionally, indium tin foil can be used in various other industries, including aerospace, automotive, and medical, where its unique properties offer benefits such as corrosion resistance, solderability, and ductility.