Indium solder wire plays a crucial role in thermal management for high-performance computing chips. As chip performance and application demands continue to grow, thermal design becomes paramount, with indium widely used as a Thermal Interface Material (TIM) due to its high thermal conductivity, low melting point, ease of processing, and environmental friendliness. Research into optimizing the application of indium TIM includes studying assembly methods, the use of flux, and indium’s wetting properties to improve its application efficiency and reliability.

In the semiconductor packaging field, the application of indium is also extensive. It is used not only to manufacture substrates that provide stable support and circuit connections but also as a soldering material to connect chips and packaging substrates. Indium’s low melting point, good conductivity, malleability, and corrosion resistance make it an ideal choice for semiconductor packaging. These characteristics help ensure stable signal transmission and adapt to various packaging requirements.

The application of indium solder wire in thermal packaging also manifests in its ability to adapt to different environments. In inert environments, indium solder wire diffuses more easily than in air and exhibits better wetting properties for indium TIM with thinner oxides. This is because molten indium can overcome oxide barriers during phase transition in inert environments, whereas indium fails to wet in air. Testing the adhesion strength of overlap joints combining gold-plated substrates with indium TIMs of different oxide thicknesses showed that oxide layer thickness significantly reduced joint strength because oxides and surface contaminants hindered the good wetting of molten solder on the weldable surface.

In addition, indium-tin alloy heat sinks, due to their excellent thermal conductivity and mechanical properties, can rapidly conduct and dissipate the heat generated by devices, ensuring the normal operation of equipment. These heat sinks are suitable for various applications such as electronic devices, photovoltaic power systems, LED lighting, and industrial equipment to improve heat dissipation efficiency and stability.

In summary, the application of indium solder wire in thermal packaging demonstrates its good adaptability to different environments, especially in inert environments where its heat dissipation effect is more pronounced. Meanwhile, indium-tin alloy heat sinks, as an efficient thermal solution, exhibit unique advantages in multiple fields.