Indium foil is used in semiconductor sealing to leverage its unique physical and chemical properties, improving the overall performance of the sealing.
Here are the key benefits:
- Excellent Thermal Conductivity: Indium foil’s high thermal conductivity significantly enhances the heat dissipation efficiency of semiconductor devices. During packaging, it serves as a thermal interface material, effectively transferring heat from the chip to the heatsink or casing, preventing performance degradation or damage due to overheating.
- Superior Electrical Conductivity: The excellent electrical conductivity of indium foil makes it an ideal material for connecting semiconductor chips to external circuits. It can replace gold or copper wire bonding in packaging, providing stable electrical connections.
- Low Melting Point and Good Flow Properties: With a melting point of about 156.6°C, indium foil can fill microscopic gaps in the sealing through melting, improving the seal and mechanical strength of the package.
- Good Plasticity: Indium foil is highly ductile, allowing it to be easily shaped to fit various chip sizes and indium foil sealing designs.
- High Purity: High-purity indium foil contains minimal impurities, which is crucial for semiconductor sealing as impurities can affect device performance and reliability.
- Environmental Stability: Indium foil maintains its stability across a wide temperature range, making it suitable for semiconductor sealing in various environmental conditions.
These characteristics of indium foil not only enhance thermal management and electrical connectivity but also improve the overall reliability and long-term stability of the sealing. Consequently, indium foil has become an indispensable material in high-performance semiconductor device sealing.